DI-EMCS-80199C

Electromagnetic Interference Control Procedures (EMICP)

The EMICP provides data to evaluate the contractor's design procedures and techniques for subsystems and equipment used to meet electromagnetic interference (EMI) control requirements based on MIL-STD-461.

Approval DateNovember 30, 2007

AMSC NumberF9030

Preparing Activity—

Project Number—

OPR11 (ASC/ENA)

DTIC Applicable—

GIDEP Applicable—

Limitation—

Applicable Forms—

Approval Limitation—

Form Version—

DID Formatdd_form_1664

963C CompliantNo

DISTRIBUTION STATEMENT A: Approved for public release; distribution is unlimited.

Supersedes

DI-EMCS-80199B

DI-EMCS-80200CDI-EMCS-80201C

Description & Purpose

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Application & Interrelationship

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Use & Relationship

a. This Data Item Description (DID) contains the format, content, and intended use information for the data deliverable resulting from the work task described for EMICP in paragraph 5.1 of MIL-STD-461.

b. This DID is related to DI-EMCS-80200C, Electromagnetic Interference Test Report (EMITR) and DI-EMCS-80201C, Electromagnetic Interference Test Procedures (EMITP).

c. DI-EMCS-80199C supersedes DI-EMCS-80199B.

Preparation Instructions

1Reference documents.The applicable issue of the documents cited herein, including their approval dates and dates of any applicable amendments, notices, and revisions, shall be as specified in the contract.

2Format.Contractor format is acceptable.

3Content.The EMICP shall contain the following:

3.1Management.The EMICP shall address the following management areas:

3.1.1Specific organizational responsibilities, lines of authority and control, and program planning, including milestones and schedules.

3.1.2Detailed EMI requirements imposed on subcontractors.

3.1.3Role in program of Government Furnished Equipment and subcontractor items.

3.1.4Description of the equipment or subsystem, its function, characteristics, and intended installation.

3.1.5Plans and procedures for identifying and resolving potential EMI problems, implementing solutions, and verifying solutions through analysis and testing.

3.1.6Point of contact for EMI technical issues.

3.2Design techniques and procedures.The EMICP shall describe the specific design techniques and procedures used to meet each emission and susceptibility requirement, including the following:

3.2.1Spectrum management techniques.

3.2.2EMI mechanical design, including the following:

3.2.2.1Type of metals, casting, finishes, and hardware employed in the design.

3.2.2.2Construction techniques, such as isolated compartments; filter mounting, isolation of other parts; treatment of openings (ventilation ports, access hatches, windows, metal faces and control shafts), and attenuation characteristics of Radio Frequency (RF) gaskets used on mating surfaces.

3.2.2.3Shielding provisions and techniques used for determining shielding effectiveness.

3.2.2.4Corrosion control procedures.

3.2.2.5Methods of bonding mating surfaces, such as surface preparation and gaskets.

3.2.3Electrical wiring design, including cable types or characteristics, cable routing, cable separation, grounding philosophy, and cable shielding types and termination methods.

3.2.4Electrical and electronic circuit design, including the following:

3.2.4.1Filtering techniques, technical reasons for selecting types of filters, and associated filter characteristics, including attenuation and line-to-ground capacitance values of AC and DC power line filters.

3.2.4.2Part location and separation for reducing EMI.

3.2.4.3Location, shielding, and isolation of critical circuits.

3.3Analysis.The EMICP shall provide analysis results demonstrating how each applicable requirement is going to be met.

3.4Developmental testing.The EMICP shall include a discussion of testing to be performed during development (such as evaluations of breadboards, prototypes, and engineering models).

References

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