DI-IPSC-80409A

Integrated Circuit Graphics Database

This DID defines the format and content preparation instructions for the integrated circuit graphics database documenting geometric and layout information used to generate custom integrated circuits.

Approval DateNovember 21, 2006

AMSC Number7644

Preparing Activity—

Project Number—

OPRNS/I5221

DTIC ApplicableNo

GIDEP ApplicableNo

Limitation—

Applicable Forms—

Approval Limitation—

Form Version—

DID Formatdd_form_1664

963C CompliantNo

DISTRIBUTION STATEMENT A: Approved for public release; distribution is unlimited.

Supersedes

DI-IPSC-80409

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Description & Purpose

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Application & Interrelationship

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Use & Relationship

This data base documents all geometric and associated layout information used in the generation on integrated circuits.

This Data Item Description (DID) contains the format and content preparation instructions for the integrated circuit graphics data base generated by the specific and discrete task requirement as delineated in the contract.

Normally used when custom integrated circuits are being developed in conjunction with other integrated circuit data items.

This DID supercedes DI-IPSC-80409.

Preparation Instructions

1Reference documents.None.

2Format and Content:

2.1The contractor shall prepare and deliver cell development data in accordance with the following:

2.1.1The contractor shall utilize and submit the computer aided cell development data on digital media in the following order of preference:

2.1.1.1CD-ROM

2.1.1.28mm Helical Scan Tape

2.1.1.34mm Digital Audio Tape

2.1.2The contractor shall utilize electronic media, in accordance with the instructions for digital submissions, for all other documentation and reports.

2.2Database file format:

2.2.1GDS II Files shall be in accordance with the GDS II stream format.Note: Data shall be in uncompressed format.

2.2.2Information contained in the library shall be complete.Any graphic cell (or structure) used in describing the integrated circuit or any other graphic cell (including test) shall be included in the library.

2.3Documentation.

2.3.1The following information shall be provided on 8 1/2 x 11 inch (Metric size A4) paper:

2.3.1.1Title. Chip name/project name.

2.3.1.2Company/division.

2.3.1.3Contract number.

2.3.1.4Revision date of chip or cells (as appropriate).

2.3.1.5Circuit description.

2.3.1.6GDS II stream format.

2.3.1.7Name(s) of library or libraries.

2.3.1.8Name of graphic cell or structure containing the chip description.

2.3.1.9Cross reference of graphic layers as they correspond to fabrication.Note: For clarification, this is the "Layer Map Table".

2.3.1.10Listing of the line code table used to resolve polygons (if applicable).

2.3.1.11Data scale in design units (i.e., Mils, Microns, etc) per GDS.

2.3.1.12Date created.

2.3.1.13Revision date of chip or cells (as appropriate).

2.3.1.14Chip 0N number.

2.3.1.15Classification.

2.3.1.16Number of files.

2.3.1.17Contract number.

2.3.2A peel-off label shall be affixed to each media with the following information:

2.3.2.1Chip name/project name.

2.3.2.2Date created.

2.3.2.3GDS II stream format

2.3.2.4Name(s) of library or libraries.

2.3.2.5Classification.

References

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