DI-MCCR-80499A

Computer Aided Chip Development Data

Computer Aided Chip Development Data documents fabrication of a chip using computer aids and is used by the Government to evaluate the reliability of the integrated circuit device produced by the contractor.

Approval DateNovember 21, 2006

AMSC Number7645

Preparing Activity—

Project Number—

OPRNS/I5221

DTIC ApplicableNo

GIDEP ApplicableNo

Limitation—

Applicable Forms—

Approval Limitation—

Form Version—

DID Formatdd_form_1664

963C CompliantNo

DISTRIBUTION STATEMENT A: Approved for public release; distribution is unlimited.

Supersedes

DI-MCCR-80499

DI-MCCR-80500A

Description & Purpose

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Application & Interrelationship

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Use & Relationship

Computer Aided Chip Development Data documents fabrication of a chip using computer aids.

This data product is used by the Government to evaluate the reliability of the integrated circuit device produced by the contractor.

This Data Item Description (DID) contains the format and content preparation Instructions for the data product generated by the specific and discrete task requirement as delineated in the contract.

This DID supercedes DI-MCCR-80499.

This DID is related to DI-MCCR-80500A, Computer Aided Cell Development Data.

Preparation Instructions

1Reference documents.None.

2Format and Content.

2.1The contractor shall prepare and deliver cell development data in accordance with the following

2.1.1The contractor shall utilize and submit the computer aided cell development data on digital media in the following order of preference

2.1.1.1CD-ROM

2.1.1.28mm Helical Scan Tape

2.1.1.34mm Digital Audio Tape

2.1.2The contractor shall utilize electronic media, in accordance with the instructions for digital submissions, for all other documentation and reports.

2.2Chip description data.This data shall uniquely describe each chip. It shall include.

2.2.1Identification.Chip name and alphanumeric text.

2.2.2Net list.Cell connectivity data which may be derived from logic description. Note: Net list shall be provided as a simulation model, preferably Verilog or VHDL formats. Other formats shall be considered, with approval at the discretion of the Government Program Manager.

2.3Chip specification (mechanical).Include bonding pad identification, bonding program, package specifications, labeling instructions, and packing specifications. Note: Format for chip specification (mechanical) data shall be in the form of electronic drawings.

References

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