DI-MISC-81592A

Thermal Survey Report

The Thermal Survey Report documents results of thermal surveys on equipment and test chambers, identifying hot spots and time to thermal stabilization for the procuring activity to assess readiness.

Approval DateNovember 21, 2006

AMSC Number7647

Preparing Activity—

Project Number—

OPRNS/I5223

DTIC ApplicableNo

GIDEP ApplicableNo

Limitation—

Applicable Forms—

Approval Limitation—

Form Version—

DID Formatdd_form_1664

963C CompliantNo

DISTRIBUTION STATEMENT A: Approved for public release; distribution is unlimited.

Supersedes

DI-MISC-81592

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Description & Purpose

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Application & Interrelationship

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Use & Relationship

This report covers the results of specified thermal surveys performed on equipment and test chambers to determine "hot spots" and temperature time to thermal stabilization. The report will be used by the procuring activity to determine equipment and test chamber readiness.

This Data Item Description (DID) contains the format and content preparation instructions for the data product generated by the specific and discrete task equipment for this data included in the contract.

This DID supersedes DI-MISC-81592.

Preparation Instructions

1Reference documents.None.

2Format:The report shall be in contractor's format.

3Content:The Thermal Survey Report shall contain the test data obtained during specified thermal survey tests and shall include:

3.1A description of thermal survey test conditions, including the following:

3.1.1Number and type of probes and measuring devices used.

3.1.2Locations of the probes and instrumentation used to measure temperatures of part and ambient chamber air.

3.1.3Temperatures and related time durations to which equipment was subjected.

3.2Temperature measurements on the parts identified as high power dissipating parts and components, and those representatives of part populations.A temperature versus time plot will be included that shows the temperature profile for each measurement point. The plot will also indicate the temperature being commanded by the chamber controller and the actual chamber.

3.3Temperature time to reach thermal stabilization for parts or components exhibiting high thermal inertia.(In addition to high temperature measurements, this data shall also include low temperature measurements wherever temperature cycling is required in Environmental Stress Screening (ESS) or reliability testing. Provide plots of part temperature as related to the chamber air temperature and time in chamber.)

3.4A comparison between the thermal data taken during thermal tests and the thermal data arrived at analytically and the thermal limits recommended by the manufacturer of the part and actual manufacturer thermal ratings and temperatures used for determining failure rates reliability predictions for all "hot spots" items.

3.5Description/identification of equipment under test, equipment serial number, date of test and location of test facility.

3.6Methods and test equipment/instrumentation used to perform the survey including manufacturer, model numbers and accuracies.A diagram of test set-up shall be provided.

3.7Discussion of thermal measurements accuracy.

3.8Identification of any "hot spot" item, i.e., items exhibiting, during the Thermal survey, temperatures in excess of those permitted by the item specification or in excess of the derating limit for the item as applicable to the equipment under procurement.

3.9The flow rate(s) of coolant(s) used in equipment(s) and their inlet and outlet temperatures.

References

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