DI-QCIC-80864

Scanning Electron Microscope Analysis Report

The Scanning Electron Microscope (SEM) Analysis Report documents the quality and acceptability of metallization on semiconductor dice, addressing batch-process-oriented metallization defects.

Approval DateJune 22, 1989

AMSC NumberG4767

Preparing Activity—

Project Number—

OPRG/Y253

DTIC Applicable—

GIDEP Applicable—

Limitation—

Applicable Forms—

Approval Limitation—

Form VersionMAR 87

DID Formatdd_form_1664

963C CompliantNo

DISTRIBUTION STATEMENT A: Approved for public release; distribution is unlimited.

Supersedes

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Description & Purpose

The purpose of the Scanning Electron Microscope (SEM) Analysis Report is to document the quality and acceptability of metallization on semiconductor dice. It addresses the specific metallization defects that are batch process orientated and that can best be identified utilizing this method.

Application & Interrelationship

This Data Item Description (DID) contains the format and content preparation instructions for the data product resulting from the work task described in MIL-STD-883, Method 2018.

Use & Relationship

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Preparation Instructions

10.1Reference documents.The applicable issue of the documents cited herein, including their approval dates and dates of any applicable amendments, notices, revisions, shall be as specified in the contract.

10.2Format.The report may be in the contractor's format.

10.3Content.Refer to MIL-STD-883, Method 2018, for additional content clarification. The report shall include the following:

10.3.1Title page.The title page shall contain:

10.3.1.1Title of the report

10.3.1.2Contract name and number

10.3.1.3Contractor's name

10.3.1.4Date of document preparation

10.3.1.5Names of individuals who prepared the report

10.3.1.6Security classification

10.3.2Photographs.There shall be a minimum of three photographs per lot. Two photographs shall show the worst case oxide steps and one photograph shall the worst case general metallization. If any photograph shows another apparent defect within the field of view, another photograph shall be included to certify the extent of the apparent defect.

10.3.3Photograph information.The following information shall be traceable to each photograph:

10.3.3.1Manufacturer's lot identification number

10.3.3.2SEM operator/inspector's identification

10.3.3.3Date of SEM report.

10.3.3.4Manufacturer

10.3.3.5Device/circuit identification (type or part number)

10.3.3.6Area of photographic documentation

10.3.3.7Magnification

10.3.3.8Electron beam accelerating voltage

10.3.3.9Viewing angle

References

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