DI-QCIC-80885

Integrated Circuit Photomicrograph

The Integrated Circuit Photomicrograph provides a pictorial representation of custom and hybrid ICs to familiarize inspectors with device types unique to a manufacturer's facility, serving as a permanent historical and legal record.

Approval DateAugust 1, 1989

AMSC NumberG4795

Preparing Activity—

Project Number—

OPRG/Y253

DTIC Applicable—

GIDEP Applicable—

Limitation—

Applicable Forms—

Approval Limitation—

Form VersionMAR 87

DID Formatdd_form_1664

963C CompliantNo

DISTRIBUTION STATEMENT A: Approved for public release; distribution is unlimited.

Supersedes

DI-E-5312A

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Description & Purpose

The Integrated Circuit (IC) photomicrograph provides a pictorial representation of custom and hybrid ICs in order to familiarize inspectors with the device types (e.g., topological layout) unique to a particular manufacturer's facility. This data will provide a permanent historical and legal record.

Application & Interrelationship

This Data Item Description (DID) contains the format and content preparation instructions for the integrated circuits photomicrographs generated by the specific and discrete task requirement as delineated in the contract.

This data will supplement MIL-STD-883, Method 2010.7.

This DID supersedes DI-E-5312A.

Use & Relationship

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Preparation Instructions

1Format.The IC photomicrograph shall consist of a negative and an 8" x 10" color photomicrograph of each custom and hybrid IC produced under the contract. Each photomicrograph shall be identified by the applicable drawing number and placed in a protective, transparent cover.

2Content.The entire die shall be visible in each color photomicrograph with the following items specifically identified (e.g., items may be marked by arrows and symbols keyed to a separate reference page):

2.1Metallization tracks (supply voltage, ground, clock, etc.)

2.2Type of wire bond (ultrasonic, wedge, ball bond, etc.), and type of wire (aluminum, gold, etc.).

2.3Tunnel diffusions (cross-overs), contact cuts, and basic chip geometry dimensions.

2.4Geometrically different transistors, including drain, source, and gate electrodes.

2.5Input and output gates, protective diodes, and passive devices.

References

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