DI-QCIC-81707

Destructive Physical Analysis Report

The Destructive Physical Analysis (DPA) report identifies time dependent failures, latent defects, and precap visual inspection defects in devices.

Approval DateNovember 24, 2006

AMSC Number7661

Preparing Activity—

Project Number—

OPRNS/I5231

DTIC ApplicableNo

GIDEP ApplicableNo

Limitation—

Applicable Forms—

Approval Limitation—

Form Version—

DID Formatdd_form_1664

963C CompliantNo

DISTRIBUTION STATEMENT A: Approved for public release; distribution is unlimited.

Supersedes

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Description & Purpose

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Application & Interrelationship

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Use & Relationship

The Destructive Physical Analysis (DPA) report identifies time dependent failures, latent defects, and precap visual inspection defects in devices.

This Data Item Description (DID) contains the format and content preparation instructions for the DPA report resulting from the work task described in MIL-STD-1580(B)1, "Destructive Physical Analysis for Electronic, Electromagnetic, and Electromechanical Parts" (entire document).

Preparation Instructions

1Reference documents.The applicable issue of the documents cited herein, including their approval dates and dates of any applicable amendments, notices, and revisions, shall be as cited in the current issue of the DODISS at the time of the solicitation.

2Format.The Destructive Physical Analysis report shall be in the contractor's format.

3Content.The Destructive Physical Analysis report shall contain the following information.

3.1Cover Sheet.The following information shall be included on the cover sheet:

3.1.1Part type

3.1.2Manufacturer's name

3.1.3Equipment part is used in

3.1.4National Stock Number (if applicable)

3.1.5Manufacturer's part number and 0N number (if different)

3.1.6Date lot code

3.1.7Quantity procured

3.1.8Destructive Physical Analysis sample size

3.1.9Contract number

3.1.10Program name

3.1.11Date Destructive Physical Analysis initiated and completed

3.1.12Serial numbers of Destructive Physical Analysis samples

3.1.13Destructive Physical Analysis report number

3.1.14Name of analyst

3.1.15Report date

3.1.16Approval signatures

3.2Summary.This section shall describe the results of all tests performed in the Destructive Physical Analysis. Any anomalous or discrepant conditions found shall be noted, to include any additional analysis performed (e.g. scanning electron microscope analysis, high magnification photographs, etc.) and referenced to the applicable sections of MIL-STD-1580(B)1 or the contractor's previously approved Destructive Physical Analysis plan. It shall also include any conclusions and recommendations.

3.3Photographs.The report shall contain a minimum of two views of high quality original photographs (color required for transistors, diodes, hybrids, and integrated circuits) for each sample. The photographs shall show an overall view of the delidded/depotted/open device and an increased magnification view of critical construction features of the device.

3.3.1Identification.Each of the views shall be identified by:

3.3.1.1Part number

3.3.1.2Serial number

3.3.1.3Figure reference number

3.3.1.4Magnification ratio

3.4Integrated circuits and hybrid devices.One of the overall delidded views of each device shall be labeled so as to completely describe the following:

3.4.1Bonding material used

3.4.2Package construction

3.4.3Package materials

3.4.4Types of bonding used

3.5Additional information.For all parts (except integrated circuits and hybrids), one of the overall views shall be labeled so as to completely describe the construction of the device. The labeling shall include an identification of all discernable features and materials used in the construction of the device.

References

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